Application Ultrasonic Soldering Iron Scope of application Larger welded area Laboratory or small-scale production use Can be used for brazing of electronic products, metal brazing, etc. Application field (1) Solid-state bonding of power semiconductors: Power semiconductors have high requirements for heat dissipation and temperature resistance of chips. Traditional solder paste reflow processes face void defect and flux residue problems, while ultrasonic brazing not only improves production efficiency. It can also [...]