Ultrasonic Tinning Welder The ultrasonic soldering process excels in the removal of protective gold, silver, and other platings from lead surfaces. Military specifications recommend ultrasonic soldering for gold removal. Ultrasonic tinning has been successful in restoring the solderability of component leads that could not be recovered using the fluxes allowed by military and other specifications. The vigorous mechanical scrubbing provided by ultrasonic energy surpasses many other mechanical recovery techniques. Ultrasonic [...]

Ultrasonic Soldering Process The ultrasonic soldering process does not use flux. Ultrasonic cavitation and implosion provide the mechanism to mechanically remove surface oxides to allow solder adhesion to take place. Since there is no flux used, there is no chance of solder splatter or the inclusion of flux or flux decomposition byproducts in the solder coating. The necessity to remove flux residues after soldering is also eliminated. Since there is [...]