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Chip System Complexity is Changing the Chip Design Ecosystem

Chip System Complexity is Changing the Chip Design Ecosystem The complexity of the chip system has a multifaceted impact on the chip design ecosystem. Driven by applications, the complexity of the chip system increases, and the number of highly complex subsystems on the entire chip system increases, which also increases the number of embedded processors required on the chip. On the one hand, applications drive the increase in demand for [...]

By |2023-03-06T08:22:13+00:0028 2 月, 2023|Uncategorized|Chip System Complexity is Changing the Chip Design Ecosystem已关闭评论

Chip Verification Will Become a Top Priority

Chip Verification Will Become a Top Priority In addition to new design IP, the verification of complex chips will become another challenge. As mentioned earlier, complex chips include more and more subsystems. First, the verification of each subsystem will become more and more challenging as its complexity increases. Secondly, the collaborative work and verification of multiple complex subsystems will become another difficulty in chip verification. Finally, there is heterogeneity in [...]

By |2023-03-06T08:24:17+00:0025 2 月, 2023|Uncategorized|Chip Verification Will Become a Top Priority已关闭评论

Highly Conductive Ceramic Substrates Welding

Highly Conductive Ceramic Substrates Welding Highly conductive Ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single or double sided) of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate made has excellent electrical insulation performance, high thermal conductivity, excellent solderability, and high adhesion strength. It can etch various patterns like a PCB board, [...]

By |2023-04-04T07:27:02+00:0024 2 月, 2023|Uncategorized|Highly Conductive Ceramic Substrates Welding已关闭评论

Photo Resist Spray Coating Machine

Photo Resist Spray Coating Machine Cheersonic's Photo Resist Spray Coating Machine. Ultrasonic spraying technology is used for semiconductor photoresist coating. About Cheersonic Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive. Our coating solutions are environmentally-friendly, efficient and highly reliable, [...]

By |2023-03-06T08:25:36+00:0022 2 月, 2023|Uncategorized|Photo Resist Spray Coating Machine已关闭评论

Spraying Graphene-added Coating Solutions

Spraying Graphene-added Coating Solutions Ultrasonic spraying equipment can be applied to graphene-added coating solutions. About Cheersonic Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive. Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, [...]

By |2023-03-06T08:28:08+00:0021 2 月, 2023|Uncategorized|Spraying Graphene-added Coating Solutions已关闭评论

Electrochemical Sensors Coatings

Electrochemical Sensors Coatings Ultrasonic coating equipment can be used for electrochemical sensors coating by applying functional coatings to commercially available screen-printed electrodes and the UAM4000L Ultrasonic Sprayers may be suitable to out application. About Cheersonic Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized [...]

By |2023-03-06T08:29:57+00:0019 2 月, 2023|Uncategorized|Electrochemical Sensors Coatings已关闭评论

Light Metals Welding

Light Metals Welding Light Metals Welding - Ultrasonic Soldering Iron - Cheersonic Metals with a relative density of less than 5. It is divided into two categories: nonferrous light metals and rare light metals. "Non ferrous light metals include aluminum, magnesium, calcium, titanium, potassium, strontium, and barium. The first four are mostly used as reducing agents in industry. Aluminum, magnesium, titanium, and their alloys have low relative density, high strength, [...]

By |2023-04-04T07:34:12+00:0018 2 月, 2023|Uncategorized|Light Metals Welding已关闭评论

Gallium Oxide-Ga2O3

Gallium Oxide-Ga2O3 Gallium oxide single crystal material is the fourth-generation wide-bandgap semiconductor material after Si, SiC and GaN. Power devices based on β-Ga2O3 single crystal have higher breakdown voltage and lower on-resistance , so that it has lower conduction loss and higher power conversion efficiency, and has great application potential in power electronic devices. Gallium oxide is a new type of semiconductor crystal material from Japan, which can produce high-quality, [...]

By |2023-03-07T01:21:01+00:0017 2 月, 2023|Uncategorized|Gallium Oxide-Ga2O3已关闭评论

Spray Deposition Nanowires Inks

Spray Deposition Nanowires Inks Ultrasonic spray deposition nanowires inks About Cheersonic Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive. Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water [...]

By |2023-03-07T01:22:54+00:0014 2 月, 2023|Uncategorized|Spray Deposition Nanowires Inks已关闭评论

Chip Verification Develops Towards Agile Verification

Chip Verification Develops Towards Agile Verification Chips are getting bigger and more complex, and we need more testing. Moreover, the ultra-complex system engineering of chip development is gradually developing in the direction of "system-level verification test-driven development", because system-level verification testing can expose and discover potential problems introduced in each link of system-level engineering, and prove the overall design. correct. At the same time, most of the new agile design [...]

By |2023-03-07T01:24:33+00:0011 2 月, 2023|Uncategorized|Chip Verification Develops Towards Agile Verification已关闭评论
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