The purpose of this device is to solder electrodes (ribbons) on the surface of solar cell substrate.
The main focus point is soldering on glass substrates, bonding semiconductor cells (CIS, CIGS etc.) and soldering on amorphous silicon for thin film solar cells.

We have samples available in stock to ship to the customer if necessary. We also encourage potential customers to visit us and witness the process in house.
Please feel free to ask us for more details.

• Low cost due to elimination of expensive metals such as silver and indium
• No organic materials used – long lifetime and reliability
• Oxide layer broken by ultrasonic vibrations: easy soldering and bonding
• Order made device suitable for various PCB sizes (1×1 to 3×4)
• Electrodes can be soldered on pre-soldered surfaces
• Junction box lining (panel back side, terminals, T-bar)

• CIS, CIGS materials
• Amourphous silicon for thin film