Ultrasonic Bonding Soldering

Basic soldering patterns

Ultrasonic soldering machines perform various tasks during its operations, however core soldering processes can be divided into 3 basic soldering patterns. Each soldering pattern has been formed to provide best soldering performance with given substrate or industrial field.

Point pre-soldering & point bonding
Flux-free two step bonding method, usually performed by two individual machines. Pre-soldering machine places bumps in required distance on the substrate by using heat and ultrasonic oscillations. Coated component (e.g. ribbon) is placed over the pre-soldered area and bonded to by small pressure and heat, which remelts bumps and coating.

Line pre-soldering & line bonding
Flux-free two step bonding method, usually performed by two individual machines.

Direct soldering/bonding
Flux-free one step bonding method. Mainly used for electrode forming on glass or ceramic materials.

Ultrasonic Bonding Soldering Video