Power Semiconductors Welding

Power Semiconductors Welding – Ultrasonic Soldering Iron – Cheersonic

Power semiconductor devices mainly include power metal oxide semiconductor field-effect transistors, insulated gate bipolar transistors, and power integrated circuits. These devices or integrated circuits can operate at high frequencies, while circuits can be more energy-efficient and material efficient at high frequencies, significantly reducing equipment volume and weight. Especially for single-chip power systems with high integration, they can integrate sensor components and circuits, signal processing circuits, interface circuits, power devices and circuits on a single silicon chip, enabling them to have intelligent functions of precisely adjusting output according to load requirements and self-protecting according to overheating, overvoltage, overcurrent, and other conditions.

The tip of ultrasonic soldering iron vibrates at ultrasonic frequencies. This vibration induces cavitation in the molten solder, which breaks up and removes oxides and promotes wetting. Ultrasonic soldering iron enables the easier joining of hard-to-solder materials which are known as impossible or difficult to be soldered in conventional soldering. Eco-friendly soldering is achieved by fluxless soldering and no post treatment to remove flux. The ultrasonic soldering technology is widely used in power semiconductors. The ultrasonic soldering iron of Cheersonic produces high quality soldered joints. Using the solder alloy, can easily solder directly to glass, ceramics and other low solderability materials.

Cheersonic is an expert manufacturer of ultrasonic equipment. We have focused on ultrasonic soldering technology more than 20 years. The ultrasonic technology and automated system are researched and developed all by ourselves. In our sample and testing studio we are offering the testing of your material. According to the needs and testing result, Cheersonic would customize ultrasonic solutions for you.