Application Ultrasonic Soldering Iron

Scope of application

Larger welded area
Laboratory or small-scale production use
Can be used for brazing of electronic products, metal brazing, etc.

Application field

(1) Solid-state bonding of power semiconductors: Power semiconductors have high requirements for heat dissipation and temperature resistance of chips. Traditional solder paste reflow processes face void defect and flux residue problems, while ultrasonic brazing not only improves production efficiency. It can also improve product quality and is a new development process route for power semiconductors.

(2) Thermal connection: New energy batteries, notebook computers, mobile phones and other products all need heat treatment. The ultrasonic brazing radiator has a fast heat dissipation speed and high connection interface strength, which is a new development trend.

(3) Special connection: low temperature brazing of graphene, low temperature brazing of silicon carbide SiC, ultrasonic brazing process can be used.