Highly Conductive Ceramic Substrates Welding
Highly Conductive Ceramic Substrates Welding Highly conductive Ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single or double sided) of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate made has excellent electrical insulation performance, high thermal conductivity, excellent solderability, and high adhesion strength. It can etch various patterns like a PCB board, [...]