Hydrophilic Coating on Microfluidic Chips Hydrophilic Coating on Microfluidic Chips - Ultrasonic Spray System - Cheersonic Application: IVD Substrate: microfluidic chips, size: from a few millimeters to 15x15cm or 20x20cm max. Thickness of the film: cover surface with a thin layer of fluid/chemical/reagent Usage: R&D stage and early prototyping stages Cover with some chemicals the surface of chip excluding the channel and the chamber The ultrasonic spray coating machine from [...]

Wafer Cleaning Process Wafer Cleaning Process - Megasonic Cleaning Systems - Cheersonic In the chip manufacturing industry, semiconductor cleaning runs through the industry, and the steps account for more than 30% of the total production process. It is a key process that affects the quality of wafers and chip performance, with a market space of more than 40 billion. Although it is inferior to core equipment such as lithography machines [...]

Ultrasonic Spray Coating System For Photoresists Ultrasonic Spray Coating System For Photoresists - Cheersonic The ultrasonic spray coating systems are proven for various applications in which uniform, repeatable coatings of photoresist or polyimide films are required. Based on below application, a. Substrate: flat, square or rectangular; thickness: 1/4’’, b. Size of substrate: width/length: typically 24’’, 30-32"; c. Liquid: photoresists d. Work requirement: 5-10 coatings in a day type of thing [...]

Photoresist Composition Photoresist Composition - Deposition of Thin Photoresist Films - Cheersonic Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. Photoinitiators (including photosensitizers, photoacid generators): Photoinitiators, also known as photosensitizers or photocuring agents, are a type of energy that can absorb a certain wavelength from light (usually ultraviolet light). Photochemical reactions produce molecules [...]

Introduction of Photoresist Classification Introduction of Photoresist Classification - Deposit Photoresist - Cheersonic 1. Classification by application field Photoresists are classified by application fields and can be divided into PCB photoresists, display panel photoresists, semiconductor photoresists and other photoresists. In the PCB industry: the main photoresists used are dry film photoresist, wet film photoresist, photosensitive solder resist ink, etc. The dry film is pasted on the treated copper-clad plate with [...]

Semiconductor Packaging Semiconductor Packaging - Semiconductor Coating Systems - Cheersonic A wafer that has been processed through the previous processes results in square chips of equal size (also known as "single wafers"). The next thing to do is to get the individual chips by dicing. Freshly cut chips are fragile and cannot exchange electrical signals, and need to be handled separately. This process is encapsulation, which involves forming a protective [...]

Semiconductor Testing Semiconductor Testing - Semiconductor Coating Systems - Cheersonic The main goal of the test is to check whether the quality of the semiconductor chip reaches a certain standard, thereby eliminating defective products and improving the reliability of the chip. In addition, tested defective products do not enter the packaging step, helping to save cost and time. Electronic Die Sorting (EDS) is one test method for wafers. EDS is [...]

Semiconductor Interconnect Semiconductor Interconnect - Semiconductor Coating Systems - Cheersonic The conductivity of semiconductors lies between conductors and nonconductors (i.e. insulators), a property that allows us to fully control the flow of electricity. Components such as transistors can be built through wafer-based lithography, etching and deposition processes, but they also need to be connected to send and receive power and signals. Metals are used for circuit interconnection because of their [...]

Wafer Thin Film Deposition Wafer Thin Film Deposition - Photoresist Coating - Cheersonic To create the tiny devices inside the chip, we need to continuously deposit layers of thin films and etch away the excess, as well as add materials to separate the different devices. Each transistor or memory cell is built step-by-step through the above process. By "thin film" we mean here a "film" that is less than 1 [...]

Wafer Etching Wafer Etching - Polyimide Coatings - Photoresist Coating - Cheersonic After the photolithography of the circuit pattern on the wafer is completed, an etching process is used to remove any excess oxide film and leave only the semiconductor circuit pattern. To do this requires the use of liquid, gas or plasma to remove selected excess. There are two main methods of etching, depending on the substance used: wet [...]