Silicon Carbide Preparation Process Silicon Carbide Preparation Process - Circuit Board Spray - Cheersonic The first step is to generate raw materials, mix high-purity silicon powder and high-purity carbon powder uniformly according to the process formula, and pass a specific reaction process in the reaction chamber under high temperature conditions above 2,000°C to remove the residual and reaction powder surface in the reaction environment The adsorbed trace impurities make the [...]

Transistors Twenty Years Later Source: Adapted from IEEE. 2047 is the 100th anniversary of the invention of the transistor. What will the transistor look like then? Will they even become critical computing elements today? IEEE Spectrum asked experts around the world for their predictions. Transistors are expected to be more diverse than they are today, according to one expert. Just as processors evolved from CPUs to include GPUs, network processors, [...]

What is Semiconductor Before the discovery of semiconductors, people believed that materials in the world could only be divided into "conductive" and "non-conductive (insulating)" according to the classification of conductivity. According to the principle of "mutual independence and complete exhaustion" in the classification method, this is a very perfect classification method for materials in the world. Why does the classification of "semiconductor" still exist? In some documents, "semiconductor" is defined [...]

Metals and Nonferrous Metals Welding Metals and Nonferrous Metals Welding - Ultrasonic Soldering Iron - Cheersonic Metal is a substance with luster, ductility, conductivity, and other properties, such as iron, manganese, chromium, aluminum, magnesium, copper, lead, zinc, tin, nickel, tungsten, molybdenum, titanium, zirconium, tantalum, and niobium. Metals are divided into ferrous and non ferrous metals. Ferrous metals refer to iron, manganese, chromium, and their alloys; Non ferrous metals refer to [...]

Classification of Transistors In the past 100 years, during the development of semiconductor transistors, pioneering scientists and engineers have constantly tried various device structures and device materials to meet the requirements of integrated circuit characteristics in different fields. Various semiconductor devices are produced. Semiconductors are inherently abstract and elusive. The various names and abbreviations of semiconductors also make semiconductors more unpredictable, which brings many troubles to the electronics industry practitioners [...]

Post-Moore era In the past forty years, the continuous development of technology and architecture design has jointly promoted the continuous advancement of Moore's Law. Even today, there are still 3nm, 2nm, and 1nm advanced technologies that are far away on the horizon. However, in terms of actual trends, higher technology, more cores, and larger chip areas can no longer bring the comprehensive advantages of cost, performance, and power consumption in [...]

SiC Power Module Package Form With the development of emerging strategic industries, the application requirements of the third generation wide bandgap power semiconductor silicon carbide materials and chips, the module packaging technology at home and abroad has also developed rapidly, and the pursuit of packaging technology with low stray parameters and small size has become a close focus of packaging. Focus, domestic and foreign scientific research teams and the semiconductor [...]

Nonferrous Metals Welding Nonferrous Metals Welding - Ultrasonic Soldering Iron - Cheersonic There are only over 80 types of non-ferrous metal elements, but there are various types of non-ferrous alloys with varying properties. Non ferrous alloys generally have higher strength and hardness than pure metals, higher resistance and lower temperature coefficient of resistance, and have good comprehensive mechanical properties. Commonly used non-ferrous alloys include aluminum alloy, copper alloy, magnesium alloy, [...]

Prospect of SiC Power Module Packaging Technology Traditional material processes based on welding and wire bonding have unsolvable problems such as low melting point, high temperature creep failure, wire winding, parasitic parameters, etc. New interconnect materials are developing from welding to crimping and sintering technology. Compared with soldered power modules, the advantages of press-fit modules are as follows. (1) Welding connects the chip and the PCB board through the lead [...]

SiC Power Semiconductor In recent decades, power semiconductor devices based on the newly developed third-generation wide bandgap power semiconductor material silicon carbide (SiC) have attracted much attention due to their excellent performance. Compared with the first generation of semiconductor materials silicon (Si), germanium (Ge) and the second generation of semiconductor materials gallium arsenide (GaAs), gallium phosphide (GaP), GaAsAl, GaAsP and other compounds, SiC has wider band gap, stronger high-temperature resistance, [...]