Ultrasonic Coating System for Semiconductor Application Cheersonic provides ultrasonic coating system for semiconductor application. Ultrasonic coating system can be used for applying of catalytic layer 10-20 µm thick on membrane 500*200 mm. Ultrasonic spray coating system have been proven for various applications in which uniform, repeatable coatings of photoresist or polyimide films are required. With control of thickness from submicron to above 100 microns and able to coat any shape [...]

Battery Foil Welding Battery Foil Welding - Ultrasonic Soldering Iron - Cheersonic Battery foil is used as a collector for lithium-ion batteries. Typically, the lithium-ion battery industry uses rolled aluminum foil as the positive electrode collector. Lithium batteries typically come in two types of shapes: cylindrical and square. The interior of the battery adopts a spiral wound structure, which is separated by a very fine and highly permeable polyethylene film [...]

Polyimide Ultrasonic Spraying Polyimide Ultrasonic Spraying - Polyimide Coating - Cheersonic Ultrasonic spray systems have been proven to be suitable for various applications requiring uniform, repeatable polyimide coatings. The thickness control range ranges from sub micrometers to over 100 micrometers and can be applied to any shape or size. High uniformity and uniformity Micro flow spraying, multiple liquid feeding schemes High liquid utilization rate About Cheersonic Cheersonic is the leading developer [...]

Aluminum Oxide Welding Aluminum Oxide Welding - Ultrasonic Soldering Iron - Cheersonic Alumina is a inorganic compound, ionizable ionic crystal at high temperatures, commonly used in the manufacture of refractories. Industrial alumina is prepared from bauxite and diaspore. Al2O3 with high purity requirements is generally prepared by chemical methods. Al2O3 has many homogeneous and heterogeneous crystals, with over 10 known types, mainly including 3 crystal forms. Aluminum oxide is a [...]

How are wafer models distinguished? Wafers are mainly the difference in diameter (1) The diameters of wafers currently on the market are mainly 150mm, 200mm, and 300mm, corresponding to 6-inch, 8-inch, and 12-inch wafers respectively. The most mainstream is 300mm, which is 12-inch wafers. (2) 6-inch wafers and even 8-inch wafers are constantly being eliminated, gradually transitioning to 12-inch or even 16-inch wafers. Due to cost reasons, 12-inch wafers currently [...]

Wires Welding Wires Welding - Ultrasonic Soldering Iron - Cheersonic Wire is made of metal wire rods, coils, or metal rods as raw materials, and is processed through professional equipment such as wire drawing equipment and annealing equipment. After multiple processes such as drawing, annealing, re drawing, and re annealing, various wire (wire) products of different specifications and models are processed. Classified by material: iron wire, copper wire, stainless steel, [...]

Ultrasonic Atomization Spraying of Photoresist Photolithography technology refers to the technology of transferring the pattern on the mask plate to the substrate by means of photoresist (also known as photoresist) under the action of light. In the photolithography process, photoresist coating is an important technical link. The existing coating methods of photoresist mainly include spin coating method and spray method. The ultrasonic atomization spray coating method can be flexibly applied [...]

Soldering Wolfram Wires Wolfram wires: Fine wire made by forging and drawing tungsten bars. Wolfram wiresis mainly used in electric light sources such as incandescent lamps and halogen tungsten lamps. Wolfram wires used as various luminescent materials in light bulbs also require the addition of a small amount of potassium, silicon, and aluminum oxides during the smelting process. Wolfram wires are generally drawn using various drawing dies. It is mainly [...]

Photoresist Ultrasonic Spraying Photoresist Ultrasonic Spraying - Photoresist Spraying - Cheersonic Micro Electro Mechanical System (MEMS) is a manufacturing technology platform developed on the basis of semiconductor manufacturing technology. MEMS technology uses a series of existing technologies and materials such as lithography, corrosion, and thin film in semiconductor technology. MEMS devices use silicon as the main material. Hundreds of thousands of micro-electromechanical devices or complete MEMS can be manufactured on [...]

Sintered Materials Welding Sintered Materials Welding - Ultrasonic Soldering Iron - Cheersonic Sintering refers to the transformation of powdered materials into dense bodies, which is a traditional process. People have long utilized this process to produce ceramics, powder metallurgy, refractory materials, ultra-high temperature materials, etc. Generally speaking, the dense material obtained by sintering after forming the powder is a polycrystalline material, and its microstructure is composed of crystals, glass bodies, [...]