Ceramic Substrates and Thin-film Substrates Welding

Ceramic Substrates and Thin-film Substrates Welding – Soldering Iron – Cheersonic

Ceramic substrate refers to a special process plate where copper foil is directly bonded to the surface of alumina or aluminum nitride ceramic substrate at high temperatures. The ultra-thin composite substrate made has excellent electrical insulation performance, high thermal conductivity, excellent soldering performance, and high adhesion strength. It can also etch various patterns like a PCB board, and has great current carrying capacity. Therefore, ceramic substrates have become the fundamental material for high-power power electronic circuit structure technology and interconnection technology. Thin film substrates are the result of a combination of various proven ceramic materials and years of developed thin film metallization technology.

The tip of ultrasonic soldering iron vibrates at ultrasonic frequencies. This vibration induces cavitation in the molten solder, which breaks up and removes oxides and promotes wetting. Ultrasonic soldering iron enables the easier joining of hard-to-solder materials which are known as impossible or difficult to be soldered in conventional soldering. Eco-friendly soldering is achieved by fluxless soldering and no post treatment to remove flux. The ultrasonic soldering technology is widely used in ceramic substrates and thin-film substrates. The ultrasonic soldering iron of Cheersonic produces high quality soldered joints. Using the solder alloy, can easily solder directly to glass, ceramics and other low solderability materials.

Cheersonic is an expert manufacturer of ultrasonic equipment. We have focused on ultrasonic soldering technology more than 20 years. The ultrasonic technology and automated system are researched and developed all by ourselves. In our sample and testing studio we are offering the testing of your material. According to the needs and testing result, Cheersonic would customize ultrasonic solutions for you.