Chip Verification Develops Towards Agile Verification

Chips are getting bigger and more complex, and we need more testing. Moreover, the ultra-complex system engineering of chip development is gradually developing in the direction of “system-level verification test-driven development”, because system-level verification testing can expose and discover potential problems introduced in each link of system-level engineering, and prove the overall design. correct. At the same time, most of the new agile design languages that are developing rapidly are more biased towards system and architecture-level design definitions, which introduces the requirement of “how to quickly verify high-level design definitions”. These requirements all require faster, better, more complete, and smarter test verification tools and methodologies, namely agile verification.

At present, many EDA verification tools are transitioning to the agile direction, but what is needed is not “stragglers”, so the overall coordination between tools is also an essential feature of agile verification.

Ultrasonic spraying technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area. In the past 10 years, it has been fully demonstrated that the 3D microstructure surface photoresist coating using ultrasonic spraying technology, the prepared photoresist coating is significantly higher than the traditional spin coating in terms of microstructure wrapping and uniformity Craft.

The ultrasonic spraying system can precisely control the flow rate, coating speed and deposition volume. Low-speed spray shaping defines atomized spray as a precise and controllable pattern to avoid excessive spray when producing a very thin and uniform layer. The ultrasonic spray system can control the thickness from sub-micron to more than 100 microns, and can coat any shape or size.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Chinese Website: Cheersonic Provides Professional Coating Solutions