Highly Conductive Ceramic Substrates Welding

Highly conductive Ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single or double sided) of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate made has excellent electrical insulation performance, high thermal conductivity, excellent solderability, and high adhesion strength. It can etch various patterns like a PCB board, and has great current carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. Features: Strong mechanical stress, stable shape; High strength, high thermal conductivity, high insulation; Strong adhesion and corrosion resistance. Good thermal cycling performance with 50000 cycles and high reliability. A structure that can etch various patterns like a PCB (or IMS substrate); No pollution and public nuisance. The operating temperature is wide from – 55 ℃ to 850 ℃; The thermal expansion coefficient is close to silicon, simplifying the production process of power modules.

Highly Conductive Ceramic Substrates Welding - Ultrasonic Soldering Iron

The tip of ultrasonic soldering iron vibrates at ultrasonic frequencies. This vibration induces cavitation in the molten solder, which breaks up and removes oxides and promotes wetting. Ultrasonic soldering iron enables the easier joining of hard-to-solder materials which are known as impossible or difficult to be soldered in conventional soldering. Eco-friendly soldering is achieved by fluxless soldering and no post treatment to remove flux. The ultrasonic soldering technology is widely used in highly conductive ceramic substrates. The ultrasonic soldering iron of Cheersonic produces high quality soldered joints. Using the solder alloy, can easily solder directly to glass, ceramics and other low solderability materials.

Cheersonic is an expert manufacturer of ultrasonic equipment. We have focused on ultrasonic soldering technology more than 20 years. The ultrasonic technology and automated system are researched and developed all by ourselves. In our sample and testing studio we are offering the testing of your material. According to the needs and testing result, Cheersonic would customize ultrasonic solutions for you.