Megasonic Cleaning Applications

Megasonic Cleaning Applications – Semiconductor Cleaning – Cheersonic

Megasonic cleaning technology, as a nano-scale cleaning technology represented by ultra-precision cleaning, plays a pivotal role in the field of semiconductor cleaning, and has become a promising dark horse in the field of cutting-edge precision cleaning: it can not only complete Si wafers, GaAs, liquid crystal glass and other The cleaning of the glass mask can also complete the ultra-precision cleaning of brittle materials such as hard disks and their read-write heads, semiconductor components, photomasks, and thin-film magnetic heads. At the same time, it can handle precision cleaning in advanced packaging fields such as TSV post-etch cleaning, UBM/RDL cleaning, and bonding cleaning. With the further in-depth research, megasonic cleaning technology has gained more and more applications in the production process of semiconductors and electronic devices, and has also attracted much attention in the precision cleaning of optical devices and medical instruments.

Cheersonic can provide megasonic cleaning with a frequency of 900kHz-3000kHZ. Ultra-high frequency ultrasonic waves at the megahertz level have higher cleaning accuracy and are widely used in semiconductor cleaning, development, glue removal, etching and other fields.