Project Description

USE-28P Ultrasonic Soldering Iron Equipment

USE-28P Ultrasonic Soldering Iron Equipment make it possible to solder glass, ceramics and low-solderability metals, such as Al, Mo, stainless steel etc.

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USE-28P Ultrasonic Soldering Iron Equipment

Contact

Contact Info

Fuyang, Zhejiang, China

Phone: +86 13777867264

Mobile: +86 571 87910406

Web: https://www.u-bonder.com

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USE-28P Ultrasonic Soldering Iron Equipment

Introduction

USE-28P Ultrasonic Soldering Iron make it possible to solder glass, ceramics and low-solderability metals, such as Al, Mo, stainless steel etc. This is an ultrasonic soldering device that produces high quality soldered joints. The soldering iron consists of a high performance sheath heater and transducer, supplying heat and ultrasonic oscillations to the tip. Using solder alloy, you can easily solder directly to metals, semiconductors, glass and ceramic substrates and other low solderability materials, such as Al, Mo, or stainless steel.

This superior bonding technique provides an excellent airtight, weatherproof, humidity resistant seal as well as joints with good electroconductivity between interconnected layers.

Features

• ECO friendly soldering solution: Flux and flux-cleaning process are not needed.
• Perfect Soldering: No Flux Soldering, highly Solid and Reliable Soldering Joint
• Production Cost Savings & High Productivity
• Support of New Application Development: Applying to Solar Cell Glass, Semiconductor, Ceramic Heater, Soldering of Dissimilar Materials (Al-Cu, Al-Glass, Al-Ceramic)

Basic Specifications

• Frequency: 60KHz±5KHz
• Output power: 12 Watt
• Max amplitude: 8μm
• Operation panel: working temperature, power adjust switch
• Max temperature: 450℃
• Display: temperature, current

Welcome to browse our Sonic4lab store and start shopping