Semiconductor Test Probes Coating
Semiconductor test probes can be used to test the frequency of communication equipment and semiconductor testing. For mobile phones, computers, walkie-talkies, broadcasting and other industries, they will provide good test support. As a test of electronic components, the test results are not only accurate, but also precise The degree is also very high.
The production steps of semiconductor chips are roughly divided into design, manufacturing and packaging. Semiconductor probes are mainly used in semiconductor chip design verification, wafer testing, and finished product testing. They are core components throughout the entire chip production process.
The probe is generally formed by the four basic parts of the needle head, the needle tail, the spring, and the outer tube after being riveted and pre-pressed by precision instruments. Due to the very small size of semiconductor products, the size requirements for probes have reached the micron level.
Probes are used in the precise connection between wafer/chip pins or solder balls and testing machines to realize signal transmission to detect performance indicators such as conduction, current, function and aging of products.
Whether the structure of the produced probe is reasonable, whether the size error is reasonable, whether the needle has the original deflection, whether the outer insulating layer of the ordinary probe is complete, etc., will directly affect the test accuracy of the probe, and then affect the semiconductor chip product. testing and verification results.
Ultrasonic spraying technology is used to apply insulating material polyimide coating on the surface of semiconductor test probes. Compared with the dip coating process, it has the advantages of high uniformity, good microstructure and controllable coating area size.
The ultrasonic spraying system can precisely control the flow rate, coating speed and deposition amount. Low Speed Spray Shaping defines atomized spraying as a precise and controllable pattern to avoid overspray while producing very thin and uniform coatings. Ultrasonic spraying systems can control thickness from submicron to over 100 microns, and can coat any shape or size.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
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