Square Silicon Wafer is More Economical

Square Silicon Wafer is More Economical – Photoresist Coater – Cheersonic

After silicon wafers go through steps such as gluing, photolithography, etching, and ion implantation, chips will be manufactured one by one. However, at this time, the chips are still “grown” on the wafer and need to be cut to become a single chip. individual chips.

Imagine a square chip that could be cut out entirely with just a few knives. What about round chips? I’m afraid it will take several times longer than the square to cut. From the packaging direction, the square chip is also convenient for wire operation. Even if it is a Flip chip package, the square shape is more convenient for the machine to operate the chip to align the I/O interface with the pad.

The most important point is that circular chips cannot solve the problem of wasting silicon wafer area. Cutting many square areas on a wafer, these areas will not have gaps in the middle, only leaving gaps at the edge of the wafer. However, if many circular areas are cut from a plane, some areas in the middle will be wasted, and the waste of the periphery of the wafer cannot be avoided.

The current mainstream chips are made from the substrate of monocrystalline silicon wafers. Due to the manufacturing process of monocrystalline silicon, the silicon wafers are circular. Its area is limited, and the size specifications are 6 inches, 8 inches, 12 inches, etc. Mass production of chips needs to consider cost-effectiveness. The more chips with good performance on the same base, the better. Therefore, if you want to get as many chips as possible on a limited silicon base, the rectangle is the highest utilization rate of silicon wafer area. solution

Ultrasonic spraying is a simple, economical and repeatable process for photoresist coating in square silicon wafer processing. Ultrasonic coating systems use advanced layering techniques to finely control flow rate, coating rate and deposition volume. Low velocity spray shaping defines the atomized spray as a precise, controlled pattern, avoiding overspray while producing a very thin, uniform layer. Direct spraying using ultrasonic technology has proven to be a reliable and effective method for depositing photoresist onto 3D microstructures, reducing equipment failures caused by over-exposure of metals to etchant.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Chinese Website: Cheersonic Provides Professional Coating Solutions