Ultrasonic Bonder Technology
Our ultrasonic soldering technology has enabled flux free soldering on glass, ceramics, aluminium, stainless steel, titanium, transparent conductive oxides and other materials previously considered unsolderable or difficult to solder.
Our engineers started to develop new products based on this unique technology, including new solder alloys, photovoltaic ribbon, ultrasonic soldering iron,ultrasonic soldering machines and special customized automated production lines.
Our ultrasonic solder is now not only used in research laboratories but also in massproduction process where it is applied as an interconnection layer between various components and substrates.
How Ultrasonic Soldering Works
Ultrasonic soldering is a flux free method which is considered more eco-friendly comparing to conventional soldering methods.
List of Solderable Materials and Substrates
Ultrasonic Soldering Technology together with the active solder alloy enables to soft soldering on ‘hart-to-solder’ and exotic substrates and metal oxides, flux free!
Advantages
The solder joints in the soldering area are flat and beautiful, and there are no bubbles or solder joints inside the solder joints to prevent oxidation.