Ultrasonic Coating System for Photoresist Deposition

Ultrasonic Coating System for Photoresist Deposition Offers Unique Advantages

Cheersonic ultrasonic atomization equipment has been used to apply photoresist film coatings on semiconductor wafers. As high-aspect-ratio MEMS and sensor manufacturing continues to expand, Cheersonic has developed a suite of photoresist thin film coatings that overcome the challenges of uniformly covering photoresist onto wafers with deep trenches or difficult topography. The UAM6000 was designed based on customer feedback and is specifically designed to meet these unique challenges. The system replaces traditional spin-coating techniques and provides more uniform sidewall and corner deposition coverage at a fraction of the photoresist consumption. Ultrasonic spraying is a proven semiconductor lithographic fabrication method used in hundreds of machines worldwide.

Our ultrasonic coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Our company Cheersonic focuses on ultrasonic technology for more than 20 years. We provide a Series of standard ultrasonic machines but also customized solution for function coating industry, such as new energy, electronic, medical, nano etc. We are glade to cooperate with companies in the energy industry to develop new solution for new energy industry and get a win-win station.

Chinese Website: Cheersonic Provides Professional Coating Solutions