Ultrasonic Soldering Process

The ultrasonic soldering process does not use flux. Ultrasonic cavitation and implosion provide the mechanism to mechanically remove surface oxides to allow solder adhesion to take place. Since there is no flux used, there is no chance of solder splatter or the inclusion of flux or flux decomposition byproducts in the solder coating. The necessity to remove flux residues after soldering is also eliminated.

Since there is no flux, there is no “wicking” of solder above the solder level. This means that solder will not wick into stranded wires or into connector contacts.

Ultrasonic Soldering Process Video