Ultrasonic Spraying of Photosensitive Materials

Ultrasonic Spraying of Photosensitive Materials – Cheersonic

Photosensitive material refers to a semiconductor material with photosensitive properties, so it is also called photoconductive material or photosensitive semiconductor. Its characteristic is that it is insulating in the absence of light and conductive in the state of light. The photosensitive material described in this article is photoresist photosensitive.

Photoresist, also known as photoresist, is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (reticle) to the substrate to be processed through photochemical reaction, exposure, development and other photolithography processes. Depending on the usage scenario, the substrate to be processed here can be an integrated circuit material, a display panel material or a printed circuit board.

Ultrasonic spray systems have proven useful in a variety of applications requiring uniform, repeatable coatings of photosensitive materials (photoresist or polyimide films). Thickness control ranges from submicron to over 100 microns and is capable of coating any shape or size.

High Uniformity and Uniformity
Micro-flow spraying, various liquid feeding schemes
high liquid utilization

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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