Ultrasonic Welding for Silicon and other Semiconductors

Ultrasonic Welding for Silicon and other Semiconductors – Soldering Iron – Cheersonic

Semiconductor materials are a type of electronic materials that have semiconductor properties (conductivity between conductors and insulators, resistivity in the range of 1m Ω· cm to 1G Ω· cm) and can be used to make semiconductor devices and integrated circuits.

The tip of ultrasonic soldering iron vibrates at ultrasonic frequencies. This vibration induces cavitation in the molten solder, which breaks up and removes oxides and promotes wetting. Ultrasonic soldering iron enables the easier joining of hard-to-solder materials which are known as impossible or difficult to be soldered in conventional soldering. Eco-friendly soldering is achieved by fluxless soldering and no post treatment to remove flux. The ultrasonic soldering technology is widely used in silicon and other semiconductors. The ultrasonic soldering iron of Cheersonic produces high quality soldered joints. Using the solder alloy, can easily solder directly to glass, ceramics and other low solderability materials.

Cheersonic is an expert manufacturer of ultrasonic equipment. We have focused on ultrasonic soldering technology more than 20 years. The ultrasonic technology and automated system are researched and developed all by ourselves. In our sample and testing studio we are offering the testing of your material. According to the needs and testing result, Cheersonic would customize ultrasonic solutions for you.